{"id":4451,"date":"2026-10-23T16:30:23","date_gmt":"2026-10-23T07:30:23","guid":{"rendered":"https:\/\/techgala.jp\/?post_type=exhibitors&#038;p=4451"},"modified":"2026-10-23T16:31:00","modified_gmt":"2026-10-23T07:31:00","slug":"e0112","status":"publish","type":"exhibitors","link":"https:\/\/techgala.jp\/en\/exhibitors\/e0112\/","title":{"rendered":"TopoLogic Inc."},"content":{"rendered":"<p class=\"wp-block-paragraph\">Founded in 2021 as a University of Tokyo spin-off, TopoLogic Inc. leverages the quantum physical properties of topological materials\u2014based on the 2016 Nobel Prize in Physics\u2014to develop &#8220;TL-SENSING,&#8221; an ultra-thin, ultra-fast-response heat flux sensor, and &#8220;TL-RAM,&#8221; an energy-efficient, high-capacity, high-speed next-generation semiconductor memory.<\/p>\n\n<p class=\"wp-block-paragraph\">With its sensor technology, we aim to solve various heat-related societal issues, such as detecting abnormal battery heat, enhancing manufacturing quality, applying it to human and animal healthcare devices, detecting hydrogen gas leaks, and predicting industrial equipment failures. With its memory technology, it is expected to provide groundbreaking devices that surpass the limits of modern computing.<\/p>\n\n<p class=\"wp-block-paragraph\">TopoLogic Inc. aims to expand its business globally through both technologies.<\/p>","protected":false},"excerpt":{"rendered":"<p>Founded in 2021 as a University of Tokyo spin-off, TopoLogic Inc. leverages the quantum physical properties of topological materials\u2014based on the 2016 Nobel Prize in Physics\u2014to develop &#8220;TL-SENSING,&#8221; an ultra-thin, ultra-fast-response heat flux sensor, and &#8220;TL-RAM,&#8221; an energy-efficient, high-capacity, high-speed next-generation semiconductor memory. With its sensor technology, we aim to solve various heat-related societal issues, [&hellip;]<\/p>\n","protected":false},"featured_media":4524,"template":"","exhibitors_country":[16],"exhibitors_theme":[12],"exhibitors_location":[],"class_list":["post-4451","exhibitors","type-exhibitors","status-publish","has-post-thumbnail","hentry","exhibitors_country-japan","exhibitors_theme-sustainable-environment","en-US"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>TopoLogic Inc. | TechGALA Japan 2026: BEYOND<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/techgala.jp\/en\/exhibitors\/e0112\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"TopoLogic Inc. | TechGALA Japan 2026: BEYOND\" \/>\n<meta property=\"og:description\" content=\"Founded in 2021 as a University of Tokyo spin-off, TopoLogic Inc. leverages the quantum physical properties of topological materials\u2014based on the 2016 Nobel Prize in Physics\u2014to develop &#8220;TL-SENSING,&#8221; an ultra-thin, ultra-fast-response heat flux sensor, and &#8220;TL-RAM,&#8221; an energy-efficient, high-capacity, high-speed next-generation semiconductor memory. 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